| This is a brief summary of the process used to manufacture most multi-layer circuit boards. We'll save the details and exceptions for later. | |
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Start with double-sided cores, thin sheets of insulating material (usually fiberglass) copper-plated on both sides |
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Print circuit patterns for all inner layers on both sides of the cores using an etch-resist material |
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Etch away the copper that isn't protected by the etch-resist, and then strip the resist off. |
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Laminate with two more single-sided copper layers for top and bottom, and insulating sheets in between. |
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Drill the holes that will be used to connect the layers of circuitry together (Unplated holes may be drilled later) |
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Plate the hole walls and surface layers with copper |
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Print and etch the patterns for the outer layers (top and bottom) using a similar procedure as the inner layers |
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Cover the board with a protective coating called soldermask, except where exposed circuitry is desired |
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Plate the exposed circuitry with a final finish to protect and maintain solderability after storage & handling |
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Apply Silkscreen (epoxy ink) as a reference legend |
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Cut the final board shapes out of the fabrication panel, and test them.
There is a lot more to learn
about PCB fabrication. We will cover more in the DFM (Design For
Manufacture) chapter, but I would also recommend |
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